Editorial Board Member - JMSN
Professor Shi received his Ph.D. degree form the California Institute of Technology (Caltech), Pasadena, CA in 1992, and has been a University of California at Irvine faculty member since then. His research covers the development of materials, processes and technologies for the manufacturing and packaging of photonic, optical, optoelectronic and semiconductor devices and systems. Prof. Shi has also served as a technical consultant for various companies and organizations in both US and abroad, and is also a co-founder for AFO Research Inc., specializing in the development of glass materials for photonic devices. Recently, Prof. Shi has been a LED IP expert for the global LED patent litigation involving Osram, Samsung and LG, related to LED chip & packaging technologies, as well as phosphor conversion technologies for white LEDs.
Professor Shi is honored by IEEE-CPMT Society in 2010 as the recipient of Outstanding Sustained Technical Contribution Award, for “being recognized for his accomplishments in multiple IEEE CPMT fields including optoelectronic packaging technology development; device and packaging materials development; electronic packaging and manufacturing technology development; and his leadership in the technology transfer of these various developments from a research environment to an industrial commercialization and production environment”.
Prof Shi was elected to be an IEEE Fellow in 2011 for his contributions in optoelectronics packaging.
His current areas of research interest include LED BLU technologies for TVs and displays; LED lighting for plant growth; Opto devices for healthcare; Silicone materials for LED packaging; Conductive pastes for solar cell and other devices; Die attach adhesives; Dielectric composites; Wavelength selective reflection composite films; fiber-optic packaging; Novel rare earth doped materials for high power lasers and phosphors for white LEDs; IC packaging and manufacturing materials and processes.
Optoelectronic devices and materials
Optoelectronic device packaging materials
Optoelectronic medical devices and packaging
White LED technologies
High power LED packaging
Other Editorial Board Members - JMSN
Department of Mechanical Engineering and Materials Science
Washington University, St. Louis
Department of Materials
Department of Applied Physics
Complutense University of Madrid
Italian Institute of Technology
Georgia Institute of Technology
Department of Materials Science and Engineering
University of Maryland
Department of Biomedical and Neuromotor Sciences
University of Bologna
School of Engineering
University of South Australia
Department of Chemical Engineering, Materials and Industrial Production
University of Naples Federico II